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AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

1 report1 sourceApr 8, 2026, 12:41 PM
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CNBCApr 8, 2026, 12:41 PM

AI's next bottleneck: Why even the best chips made in the U.S. take a round trip to Taiwan

Nvidia has reserved the majority of TSMC’s most advanced packaging capacity. The lesser-known chipmaking step may become the next bottleneck for AI.

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